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Intel 3D Chip is a Massive Revolution

posted May 5, 2011, 7:10 PM by Nathan Eliason   [ updated May 5, 2011, 7:28 PM ]
    Intel, the world's largest computer-chip maker said that this year, they will begin implementing a new 3D technology that allows for three dimensional transistors; something, they report, that has been in the making for a decade.
    The normal 2-dimensional transistors in microchips we use today are printed almost like a sheet of paper, with the on/off gate on top of the one-sided conductive electron flow, making for slower time, overheating, and power leakage. The new chips are built around a three-dimensional electron flow, dispersing the electricity around a wider area so it can flow faster, easier, and leak less power. Also, this lets Intel build three dimensional chips as opposed to the flat disks as are the norm today.
    Why should you care? This lets electronics become smaller, lighter, faster, and cooler, meaning your next smartphone or iPod in the next few years could fit a lot more bang into the device, letting electronics use limited space more efficiently. Your phone will be thinner, your laptop will be much more powerful, and Intel claims this is the most significant achievement since the 1950's introduction of the transistor, which is the basic building block of electronics.
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